| PART |
Description |
Maker |
| 449-10-210 449-10-210-00-560000 |
Interconnect Header.100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
| 449-10-206-00-560000 |
Interconnect Header .100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
| 449-10-272-00-560000 |
Interconnect Header.100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
| 335-40-132-00-160000 |
Interconnect Header .100 Grid; Straight Pin Header .018 Pin Head with Solder Tail; Low Profile Single Row
|
Mill-Max Mfg. Corp.
|
| 414-43-272-41-117000 |
Interconnect Socket .100 Grid; Surface Mount Socket Stub Tail Double Row Surface Mount Accepts .015-.025" Leads
Interconnect Socket .100 Grid; Surface Mount Socket Stub Tail Double Row Surface Mount Accepts .015-.025 Leads
|
Mill-Max Mfg. Corp.
|
| 0901200960 90120-0960 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Vertical, 40 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| SD-70287-004 |
2.54mm (.100) Pitch C-Grid? Header
|
Molex Electronics Ltd.
|
| 90136-2210 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0702800498 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail
MOLEX Connector
|
Molex Electronics Ltd.
|
| 829-22-018-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|
| 829-22-012-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|
